四国化成工業株式会社

Exhibition 2018

47th NEPCON JAPAN (19th IC & Sensor Packaging Technology EXPO)

47th NEPCON JAPAN (19th IC & Sensor Packaging Technology EXPO)
Summary
Dates Jan.17, 2018 ~ Jan.19, 2018
Venue Tokyo Big Sight, Japan
Booth Number E25-16 (Hall 3)
Organizer Reed Exhibitions Japan Ltd.
Website http://www.nepconjapan.jp/en/About/ICP/
Information

Product : GliCAP GC-703 (Chemical Adhesion Process)

                  Glicoat-SMD F3 (OSP for  Automotive PWB)

            Glicoat-SMD TS70 (Antioxidant for copper wire touch sensor)       

            Glibrite GB series (Microetching solution)

 

 

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