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What's OSP

OSP (Organic Solderability Preservative) is the most popular final surface finishing for PWBs.
OSP film has excellent humidity resistance to protect copper oxidation. For example, F2 series protect copper surface up to twelve month.

Copper surface (Before OSP)

Cross section of OSP film (FIB) (After OSP)

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Why OSP

• OSP has a lot of features.
• OSP process is lower cost than HASL and the other metal finishes.
• OSP process is good environmental. (VOC free etc.)
• OSP film is available for lead free solder application.
• Good solder joint strength compare with Ni/Au plating.

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Mechanism of OSP film formation

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OSP products line up

We can develop the active ingredient imidazole by our selves and we can supply the suitable OSP for each assembly process.

	Glicoat	Glicoat-SMD
		E series		F2 series
	T	E3	EX	F2	F2(LX)	F2(LX)PK
Process condition	30°C	40°C	30°C	40°C	40°C	40°C
	15sec	30sec	30sec	60-90sec	60-90sec	60-90sec
Active ingredient	Alkyl imidazole	Alkyl benzimidazole		New imidazole
Heat resistance
Selective gold

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Glicoat-SMD F2 series

F2 series is the most popular OSP in the world and has very high heat resistance for lead free solder.
It is available to use instead of HASL process.

Advantage of F2 series.
High heat strength and good solderbility for lead free solderMuch economical than Gold plating and HASL.
Excellent solder joint strenght compared with ENIG.
Safety and Environmentaly-friendly because of the aqueous solution.

F2 is basic product in the F2 series.

Good performance on the selective gold boards, because of no OSP film on gold pads. It is very suitable for mobile phone, memory boards.

OSP film thickness on gold pad

OSP for Flip Chip and BGA

Glicoat-SMD F2(LX) PK and L1 are OSP for BGA substrate and they have good performance even after unique and sever assembling process. Glicoat process is widely used for Flip Chip boards as well as wire bonding type because of better solder joint strength than Ni/Au plating.

Advantage

Glibrite series. (GB series)
GB series are developed by our organic synthesis technologies.

Production line up

GB-1000 series for microetching solution.
GB-3000 series for roughness pretreatment solution for Dry Film lamination.
GB-4000 series for roughness pretreatment solution for solder mask.

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GB-1400 Microetching solution for anti galvanic effect.

Features

1. H2O2/H2SO4 micretching solution.
2. Excellent residue removal performance before OSP process.
3. Preventing over-etching trouble caused by galvanic effect leas to reliable Cu-Au selective PCBs.
4. The best microetching solution for OSP process as well as Glicoat series.

Table Microetching test result with using GB-1400.
Cu: Au surface area ratio = 1: 200
Microetching amount is controlled at the Cu single pad.
GB-1400 has excellent anti galvanic performance.

Before microetching	After microetching
Initial	Conventional solution	GB-1400 New