四国化成工業株式会社

chemicals

Flame retardancy and high heat-resistance thermosetting resin
Benzoxazine

"Benzoxazine" is a new type of thermosetting resin,which can improve electrical and physical properties of its compound as an additive to other resins.Moreover, it is effective as the resin of composite materials.

Trade name P-d F-a
Appearance Light yellow solid Light yellow solid
Weight loss temp.(℃) 377 333
Solubility Soluble in MEK, Toluene, DMF Soluble in MEK, Toluene, DMF
Curing temp. >150 >150
Flame retardancy
(vs epoxy resin)
METI registration 7-908 7-908

Features

  • Superior electrical properties
  • Superior dimensional stability
  • Superior flame retardancy
  • Copolymerized with the phenolic resin and/or epoxy resin

Applications

  • Electronic materials such as CCL and EMC
  • Modifier of epoxy resin
  • Carbon fiber reinforced plastic
  • FRP of matrix resin

Formulation with epoxy resin

Bisphenol A type epoxy resin

Flame retardancy

Required amount of phosphorus base flame retardant to achieve UL-V0

Cured physical properties

Resin Type P-d F-a Epoxy※1
Flexural
modulus(GPa)
5.3 5.2 2.6
Dissipation
factor(%)
0.66 0.95 2.98
Coefficient of Linear thermal
expansion(ppm/K)
49 55 80
Boiling water※2
absorption(%)
0.3 0.3 1.6

※1 Epoxy:Bisphenol A type epoxy resin
 Curing condition 180℃/2hrs+200℃/2hrs
※2 100℃/5hrs

NEW Under development

Benzoxazine for bismaleimide

Benzoxazine and Bismaleimide (BMI) make excellent heat-resistance copolymer.
We are developing new benzoxazine for this new resin system.

Formulation NEWNew Benzoxazine/BMI
(30phr/100phr)
P-d/BMI
(30phr/100phr)
Gelation time(180℃) 2’10” 9’30”
Thermal
properties of
copolymer
(TMA)
Tg(℃) 280 251
CTE(ppm) 43 47

※Curing condition 200℃×4hrs+225℃×2hrs

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