四国化成工業株式会社

chemicals

Imidazole type curing agent for epoxy resin "CUREZOL"

“CUREZOL,” which is a kind of imidazole and an epoxy resin curing agent, provides excellent characteristics when used for Glass epoxy laminate and Epoxy Molding Compound. It is used for a wide variety of applications, including electric and electronic parts, paints, adhesives, construction materials, and sporting goods.

Basic information
Products information

Brand name

CUREZOL

Application

Epoxy curing agent or accelerator

※Polyurethane foam catalyst,Polyimide polymerization catalyst, antirust agent, rubber accelerator, flux activator, etc.

Properties as curing agent for epoxy resin

  • Only adding a small amount (1 to 10 phr) of this catalyst type curing agent, unlike polyaddition type curing agents, can prevent the viscosity of compounds from increasing even if CUREZOL in solid form is selected.
  • Cured products with excellent heat resistance can be obtained from heat treatment in a relatively short time.
  • CUREZOL, which is low in volatility, is considered less toxic than other amines.
  • Widely available to improve properties, with low curing temperature and long pot life.
  • Because of single substance, no distribution of molecule weight provides stable properties.

Application as a curing accelerator

  • As an accelerator for acid anhydrides
  • As an accelerator for dicyandiamide (DICY)
  • As a phenolic accelerator
  • As a co-curing agent in combination with amines

Application

“CUREZOL” is an imidazole type epoxy resin curing agent (accelerator) developed by Shikoku Chemicals Corporation and classified into the following series:

*All values shown here are typical values and are not guaranteed values.
*The applied registration of products for REACH will be completed by the end of May 2018.

OR(Original) series The OR series is the basic series of CUREZOL and has been adopted in a wide range of fields.

Trade name Appearance
Melting
Point (℃)
Registration Package
(kg)
Japan
CSCL
U.S.A
TSCA
EU
REACH
Korea
ECL
China
IECSC
Taiwan
ECN
SIZ solid
(88~92)
Registrated Registrated Registrated Registrated Registrated 20
2MZ-H solid
(140~148)
Registrated Registrated Registrated Registrated Registrated 20
C11Z solid
(69〜74)
Registrated Registrated Registrated Registrated Registrated 20
C17Z powder
(86~91)
Registrated Registrated Application in process Registrated Registrated Registrated 20
1.2DMZ liquid※1
(ca. 36)
Registrated Registrated Registrated Registrated Registrated 17
1×20
2E4MZ liquid※1
(ca. 40)
Registrated Registrated Registrated Registrated Registrated Registrated 17
1×20
2PZ solid
(137~147)
Registrated Registrated Application in process Registrated Registrated Registrated 20
2PZ-PW fine powder
(137~147)
Registrated Registrated Application in process Registrated Registrated Registrated 15
2P4MZ solid
(174~184)
Registrated Registrated Registrated Registrated Registrated 20
1B2MZ liquid※1
(ca. 50)
Registrated Registrated Registrated Registrated Registrated 18
1×20
1B2PZ liquid※1
(ca. 40)
Registrated※2 Registrated
(LVE)
Registrated Registrated Registrated 17
1×20

Status of registration  Registrated: Registrated  Application in process:Application in process  —:Not registered
※1 May be crystallized
※2 Low volume New Chemical Substance

CN series The CN series achieve high solubility and a lower melting point in consequence of the introduction of a nitrile group having high polarity.

Trade name Appearance
Melting
Point (℃)
Registration Package
(kg)
Japan
CSCL
U.S.A
TSCA
EU
REACH
Korea
ECL
China
IECSC
Taiwan
ECN
2MZ-CN liquid※1
(ca. 55)
Registrated Registrated Registrated Registrated 1×20
C11Z-CN solid
(47~52)
Registrated Registrated Registrated Registrated 20
2E4MZ-CN liquid※1
(ca. 30)
Registrated Registrated Application in process Registrated Registrated Registrated 17
1×20
2PZ-CN powder
(105~111)
Registrated Registrated Registrated Registrated Registrated 20

Status of registration  Registrated: Registrated  Application in process:Application in process  —:Not registered
※1 May be crystallized

CNS series The CNS series is provided with latent by salt formation with trimellitic acid, which reacts in a high temperature range.

Trade name Appearance
Melting
Point (℃)
Registration Package
(kg)
Japan
CSCL
U.S.A
TSCA
EU
REACH
Korea
ECL
China
IECSC
Taiwan
ECN
C11Z-CNS powder
(123〜129)
Registrated Registrated Registrated Registrated Registrated 15
2PZCNS-PW fine powder
(175~183)
Registrated Registrated Registrated Registrated Registrated 15

Status of registration  Registrated: Registrated  Application in process:Application in process  —:Not registered

A(Azine) series The A series has low solubility into epoxy resins and is applicable to one-component compounds. High heat resistance is achieved by introducing a triazine ring.
Trade name Appearance
Melting
Point (℃)
Registration Package
(kg)
Japan
CSCL
U.S.A
TSCA
EU
REACH
Korea
ECL
China
IECSC
Taiwan
ECN
2MZ-A powder
(248~258)
Registrated Registrated Application in process Registrated Registrated Registrated 20
2MZA-PW fine powder
(248~258)
Registrated Registrated Application in process Registrated Registrated Registrated 15
C11Z-A powder
(187~195)
Registrated Registrated Registrated Registrated Registrated 20
2E4MZ-A powder
(215~225)
Registrated Registrated Registrated Registrated 20

Status of registration  Registrated: Registrated  Application in process:Application in process  —:Not registered

OK series The OK series has longer pot life than the OR series and is also effective for DICY type curing accelerators. It has a good adhesiveness.
Trade name Appearance
Melting
Point (℃)
Registration Package
(kg)
Japan
CSCL
U.S.A
TSCA
EU
REACH
Korea
ECL
China
IECSC
Taiwan
ECN
2MA-OK powder
(dec. 260)
Registrated Registrated Application in process Registrated Registrated Registrated 15
2MAOK-PW fine powder
(dec. 260)
Registrated Registrated Application in process Registrated Registrated Registrated 15
2PZ-OK powder
(ca. 140)
Registrated Registrated Registrated Registrated 20

Status of registration  Registrated: Registrated  Application in process:Application in process  —:Not registered

HZ series The HZ series starts to react at high temperature in single curing and has the longest pot life. It is also effective for phenolic accelerators.
Trade name Appearance
Melting
Point (℃)
Registration Package
(kg)
Japan
CSCL
U.S.A
TSCA
EU
REACH
Korea
ECL
China
IECSC
Taiwan
ECN
2PHZ-PW fine powder
(dec. 230)
Registrated Registrated Registrated Registrated Registrated 15
2P4MHZ-PW fine powder
(dec. 191~195)
Registrated Registrated
(SNUR)
Registrated Registrated Registrated 15

Status of registration  Registrated: Registrated  Application in process:Application in process  —:Not registered

Others The special series means imidazoles of special rings that are not included in the series listed above.

Trade name Appearance
Melting
Point (℃)
Registration Package
(kg)
Japan
CSCL
U.S.A
TSCA
EU
REACH
Korea
ECL
China
IECSC
Taiwan
ECN
TBZ powder
(114~117)
Registrated
※2
Registrated
※3
Registrated Registrated 20
SFZ solid
(ca. 60)
Registrated Registrated Registrated Registrated 20
Order production

Status of registration  Registrated: Registrated  Application in process:Application in process  —:Not registered
※2 Low volume New Chemical Substance
※3 Some restrictions apply

ZL series Imidazolines. Since the temperature dependency of the gelation time of the ZL series is low, it is less affected by temperature variations of the heating furnace.
Trade name Appearance
Melting
Point (℃)
Registration Package
(kg)
Japan
CSCL
U.S.A
TSCA
EU
REACH
Korea
ECL
China
IECSC
Taiwan
ECN
2PZL-T solid
(95~104)
Registrated Registrated Registrated Registrated Registrated 20

Status of registration  Registrated: Registrated  Application in process:Application in process  —:Not registered

VT series The VT series is an addition type resin modifier. It has the effect of controlling the migration of silver ions, copper ions, etc.
Trade name Appearance
Melting
Point (℃)
Registration Package
(kg)
Japan
CSCL
U.S.A
TSCA
EU
REACH
Korea
ECL
China
IECSC
Taiwan
ECN
VT powder
(239~241)
Registrated Registrated Registrated 20
VT-OK powder
(>250)
Registrated Registrated Registrated 15
MAVT powder
(>170)
Registrated Registrated Registrated Registrated 20

Status of registration  Registrated: Registrated  Application in process:Application in process  —:Not registered

Reaction temperature

The below graph shows temperature distribution of exothermic reaction when heating up the compound composed of CUREZOL (5phr) and Bisphenol A epoxy resin without solvent.
These data are prepared by the compound containing CUREZOL as a hardener, not as an accelerator for acid anhydride and amine.

Solubility into solvents

A list of the solubility of our products in solvents is available in PDF format.

PDF Download

page top PageTop