四国化成工業株式会社

chemicals

Microetching solution"Glibrite" GB series

GB series are developed by our organic synthesis technology.
GB series achieve the optimum copper surface roughness for various applications.

GB-1000F/1400/200 GB-3100/GB-4300
Appearance Pinkish(Glossy) Pinkish(Glossy) --- Red brownish (Matte)
Application Pre-treatment for OSP Pre-treatment for solder resist, dry film, inner-layer
Surface morphology
Roughness
GB-1000F/1400
GB-200
GB-3100
GB-4300

Microetching solution Glibrite GB‒1000F/GB‒1400

GB-1000F/GB-1400 are H2O2/H2SO4 system microetching solution. Good compatibility for pretreatment of OSP, HASL and metalic plating.
Especially GB-1000F/GB-1400 are good compatibility with OSP and achieve high performance.
In addition, GB-1400 prevents over-etching trouble caused by galvanic effect leads to reliable PWBs.

Advantages
  • Good compatibility with Glicoat series OSP and excellent solderability
  • Excellent anti chlorine resistance, possible using city water (GB-1400)
  • Preventing over-etching trouble caused by galvanic effect leads to reliable PWBs (GB-1400)
  • Possible to provide additive chemical only
Solderability

  • Etching amount:2.0μm
  • Glicoat-SMD F2 OSP thickness:0.20μm
Test coupon
FR-4, t=1.2mm, Ø=0.60mm, 261 holes

Microetching chemical for OSP Glibrite GB-200

Suitable microetching chemical for OSP because of stable etching speed and uniform copper surface topology even high copper ion concentration.

Advantages
  • Uniform and smooth copper surface topology even low etching amount.
  • Stable etching rate even chlorine contamination.
  • Stable etching speed makes easy maintenance and dissoves easily.

Copper surface topography

Pretreatment for Dry film Glibrite GB‒3100

Glibrite GB-3100 is copper surface roughening solution for dry film pretreatment of patterning dry film and form uniform and fine roughening morphology even with low etching amount.

Advantages
  • Excellent adhesion between copper and dry film with low etching amount
  • Low defect rate of AOI due to brighter copper appearance
  • Much lower running cost by using additive type

Solder resist Pretreatment for PWB and IC substrate Glibrite GB‒4300

Glibrite GB-4300 is an additive for copper roughening solution based on H2O2/H2SO4 system, which is designed for solder resist or inner-layer resin preparation, in order to give the best adhesion with lower etching amount.

Advantages
  • Excellent solder resist adhesion with much less etching amount than conventional products
  • Suitable for super fine copper circuit and higher frequency requirement, because of lower roughness
  • Good stability in high copper concentration achieves low running cost
Property
E/A GB-4300 Parameter
(μm)
Conventional Parameter
(μm)
0.3μm Ra=0.14 Ra=0.24
Rz=1.2 Rz=2.2
RSm=2.1 RSm=3.5
0.5μm Ra=0.16 Ra=0.29
Rz=1.4 Rz=2.5
RSm=1.2 RSm=2.5
1.0μm Ra=0.19 Ra=0.38
Rz=1.5 Rz=3.2
RSm=0.9 RSm=1.2
Appearance
Lower roughness than conventional chemical

Copper roughness(Rz)

Solder resist adhesion after Gold planting

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