四国化成工業株式会社

chemicals

Chemical Adhesion Process  GliCAP GC-703

GliCAP is new interface chemical developed based on our organic synthesis technology. Unique organic coating formed on copper surface directly improves adhesion between copper and resin effectively.

Advantages

  • Excellent adhesion with solder resist and inner layer without roughening copper surface
  • Excellent signal transmission even in higher frequency application because of smooth copper surface
  • The best treatment for super fine copper circuit pattern because of no microetching
  • Simple process by direct treatment on copper

Adhesion mechanism

Adhesion mechanism

Process

Process

Cross section by FIB

Cross section by FIB

Peel strength

Peel strength

  • Sample :Innerlayer insulation build up resin(Dry film type)
  • Process :Cu treatment → Laminating → Reflow 2 times → PCT → Peel test
  • Reflow condition :Peak/260℃
  • PCT condition :121℃/100%RH/100hrs
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