四国化成工業株式会社

chemicals

Cross-linkers for Thermosetting Resin

We develop cross-linkers for thermosetting resin especially suitable for epoxy resin.
Provides excellent thermal resistance and transparency in cured product.

Features

Isocyanuric acid derivatives
Trade name MA-DGIC DA-MGIC L-DAIC C3-CIC Acid
Appearance White powder White powder Colorless liquid White powder
Registration in Japan Low Production Volume
Chemical<10t
Low Production Volume
Chemical<10t
Low Production Volume
Chemical<1t
Low Production Volume
Chemical<1t
Glycoluril derivatives
Trade name TS-G TG-G
Appearance White solid –
Yellow oil
Colorless oil
Registration in Japan Low Production Volume
Chemical<10t
Low Production Volume
Chemical<1t

Application examples

Low temperature curing adhesive Low temperature
curing adhesive
LED peripheral material (Sealant, Reflector, Die bonding) LED peripheral material
(Sealant, Reflector,
Die bonding)
Photoresist Photoresist underlay film Photoresist
Photoresist underlay film
Soldering flux Soldering flux

TS-G Epoxy resin hardener for low temperature curing

TS-G Epoxy resin hardener for low temperature curing

  • TS-G is a multi-functional (4 functional groups) thiol compound which can be used as a hardener for epoxy resins, achieves rapid curing at a low temperature.
  • Because TS-G reacts with an epoxy resin more rapidly than generic thiol agents, achievable to reduce
    the amount of catalyst in the formulation in short curing time.
  • The epoxy resin cured by TS-G has excellent thermal resistance (high Tg), humidity resistance,
    acid resistance, alkali resistance and hardness.

Comparison of Reactivity

TS-G has an excellent reactivity compared to generic thiol agents.

Comparison of Reactivity

Formulation: bisphenol type epoxy/thiol/benzyldimethylamine=100/(thiol/epoxy equivalence ratio=1)/0.5-5

Comparison of Thermal Resistance

Cured epoxy product with TS-G has excellent thermal resistance (Tg>100°C).

Comparison of Thermal Resistance

Formulation: bisphenol A type epoxy/thiol/benzyldimethylamine=100/(thiol/epoxy equivalence ratio=1)/1
Curing condition: 80°C/1 h

Comparison of Humidity Resistance

Cured product with TS-G can maintain the adhesion after keeping in the humid condition.

Comparison of Humidity Resistance

Formulation:bisphenol A epoxy resin/Thiol/BDMA= 100/(Thiol/Epoxy equivalent ratio=1)/1
Curing condition:80℃/1 h
Test method:JIS K6850

Storage Stability

Storage stability is improved by using a latent hardener and a stabilizer (boric acid triester).

Storage Stability

* Formulated amount is the gelation time becomes twice compared with initial at 85 degreeC
* Added amount was decided by gelation time becomes 2 min.

Compatibility

Compatibility with solvent and resin is improved by mixed with other thiol agents.

Compatibility

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